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Case Details

Precision CNC Machining China Magnesium Alloy Laptop Housing Custom Manufacturing Service

2025-10-27

Product Overview

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Our precision-engineered magnesium alloy laptop housing represents the forefront of lightweight structural components for modern computing devices. Manufactured using advanced thixomolding technology and CNC machining processes, these housings combine exceptional strength-to-weight ratios with superior electromagnetic interference protection. The manufacturing process involves heating magnesium alloy to a semi-liquid state before injection into precision molds, creating large, complex components with minimal material waste compared to traditional CNC aluminum machining.

The magnesium-lithium (LZ) alloy formulation significantly enhances room-temperature formability, addressing the traditional challenges associated with magnesium alloy processing. This innovation allows for the production of thin-walled structures as slender as 0.6mm while maintaining structural integrity, making these housings ideal for today's ultra-thin laptop designs.

Technical Specifications

Table: Magnesium Alloy Laptop Housing Technical Parameters

Parameter Specification Testing Standard
Material Grades AZ91D, AZ31B, LZ91 ASTM B94
Thickness Range 0.5mm - 2.0mm Customer Requirements
Tensile Strength ≥240 MPa (AZ91D) ASTM E8
Yield Strength ≥200 MPa (AZ91D) ASTM E8
Surface Hardness 60-90 HB ASTM B647
EMI Shielding Effectiveness >100 dB IEC 61000-4-21
Thermal Conductivity 80-100 W/m·K ASTM E1461
Dimensional Tolerance ±0.05mm Customer Specifications
Key Advantages

Lightweight Structural Solution

Magnesium alloy's density of approximately 1.8 g/cm³ makes it 30-50% lighter than equivalent aluminum components. This significant weight reduction enhances portability without compromising structural integrity, with finished products maintaining thickness below 18mm for standard configurations and under 21mm for discrete graphics models.

Enhanced Manufacturing Efficiency

The thixomolding process enables production of single-piece magnesium alloy components with complex structural features. This advanced manufacturing approach eliminates the material waste associated with traditional CNC machining from solid blocks, with 90% post-industrial recycled magnesium alloy content in the final product.

Superior Functional Performance

Our magnesium alloy housings provide complete electromagnetic interference absorption exceeding 100dB, eliminating the need for additional conductive coatings. The material's excellent thermal conductivity efficiently dissipates heat from internal components, maintaining optimal operating temperatures.

Applications and Customization

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Diverse Implementation Scenarios

  • Ultra-portable Laptops: Framework Laptop 16 utilizes magnesium alloy base covers for enhanced durability and reduced weight
  • Gaming Notebooks: High-performance systems benefit from effective thermal management properties
  • Industrial Computing Equipment: Superior EMI shielding ensures reliable operation in sensitive environments
  • Military-Grade Devices: Exceptional impact resistance protects internal components

Comprehensive Customization Services

We offer end-to-end customization including:

  • Material selection guidance based on application requirements
  • Structural optimization for specific performance criteria