Customer Requirements: A semiconductor manufacturing firm needed a set of custom-made aluminum alloy parts for their advanced semiconductor production equipment. These parts had to possess extremely high flatness and dimensional accuracy. For instance, the surface flatness of a key wafer holder component had to be within ±0.002mm to ensure the precise placement and movement of wafers during the semiconductor fabrication process. Additionally, the parts needed to have excellent thermal conductivity and minimal surface roughness to prevent any interference with the highly sensitive semiconductor manufacturing operations.
Solutions and Machining Processes:
CNC Milling for Precision Shaping: The company used a high-precision CNC milling machine to shape the aluminum alloy parts. The milling machine was equipped with a high-stability spindle and advanced motion control system. Technicians carefully designed the tool paths and optimized the cutting parameters to achieve the required flatness and dimensional accuracy. To minimize surface roughness, diamond-coated cutting tools were employed, and a multi-step finishing process was implemented. This involved fine milling followed by a gentle polishing operation to ensure the surface was as smooth as possible.
Quality Control and Thermal Treatment: After the initial machining, the parts underwent a strict quality control process using advanced metrology equipment such as coordinate measuring machines and surface profilometers. Any parts that did not meet the accuracy or surface finish requirements were reworked. Subsequently, the parts were subjected to a thermal treatment process to enhance their thermal conductivity and relieve any internal stresses that might have been induced during machining. This thermal treatment was carefully calibrated to ensure it did not affect the dimensional stability of the parts.
Results and Customer Feedback: The custom-made aluminum alloy parts were successfully integrated into the semiconductor production equipment. The equipment's performance and wafer production yield significantly improved due to the high-quality components. The semiconductor manufacturing firm was extremely satisfied with the machining results and the enterprise's attention to detail. They praised the company for its ability to meet the demanding technical specifications of the semiconductor industry and signed a long-term supply contract for future component needs.
